Floating Lead, Dual Access also known as Reverse Bare circuits, are typically constructed from a single conductive layer, although multiple layers with clearances to allow access to lower conductive layers can be fabricated together. The single or individual layers are firstly bonded to a pre-drilled/Routed dielectric polyimide coverlayer to form a ‘single sided type’ construction, then imaged and chemically etched before an additional bonding stage to encapsulate features where required. Typical conductive layer thickness can range from 35um to 150um of copper, although greater thickness can be processed, these are specialised printed circuits that can carry a much higher power rating dependent on trace width. A typical design requirement includes extending encapsulation (tying down) pads. By their very nature the heavier the conductive layer the less dynamic they become, they are typically effective as a static use printed circuit board.